Radeon HD Nvidia GTX R7 R9 - eGELe Video card Refurbishing KIT

Description

Currently available for Radeon HD R5 R7 and R9 series and Nvidia all GTX and high end series cards. Don't be fooled by Chinese lookalikes. Insist on genuine eGELe products. Made in the USA.
Aerospace technology has developed thermal gels with incredible properties that play right into our needs in cooling video cards.
This literature is a couple years old but it makes my point
as it covers most of the thermal product available. You will note the more successful heat transfer is because the two objects are closer in proximity. In a situation where the contact points cannot be brought together, a bridge, a pipeline has to be put in place to transfer heat generated by the GPU/CPU. This stuff doesn't come cheap; but, what GOOD stuff does?
Now imagine if you will, two contact points that are less than a scant eighth of an inch apart (a million miles in thermal dynamics - remember the closer two objects are the better they transfer heat, etc.) a semi-liquid bubble of gel marries both parts together (no matter how smooth or rough the surface it fills in all the air gaps) and the thermal bridge wicks the heat away from the chip. For high end video cards, to fill the thermal gap with a bridging device and dissipate the heat of high performance use, a more perfect combination of factors does not exist.
eGELe is designed to provide a preferential heat transfer path between heat generating components and heat sinks, heat spreaders or other cooling devices. eGELe consists of a highly conformable slightly tacky silicone elastomer sheet filled with thermally conductive ceramic particles which provide special features listed as follows.
• Very high thermal conductivity and good electrical insulation properties.
• Good softness and conformability even to non-flat surfaces.
• This version incorporates a thin polymeric film carrier for improved handling.
• Slight tack allows pre-assembly. Good wettability for better thermal conductivity.
Article
Unit
Parameter
Test Method
Thickness
MM
0.3~10
ASTMD374
Specific Gravity
g/cc
1.8~1.9
ASTMD792
Hardness Score
OA
10~35
ASTMD2240
Flammability
Cals
V-o
UL-94
Breakdown Voltage
Kv/mm
> 4KV
ASTMD149
Ther. Conductivity    w/m-k
1.4
ASTMD5470
(NOTE: Super eGELe has w/m-k of 4.9 and is +S&H)
Constant Use ℃
-40          ~ 220
ASTMD5470
Volume Impedance
Ω.cm       1.0*1011
ASTMD257
Tensile strength
Kgf/c㎡     >180
ASTMD412
Thermal Paste:
CHEM. NAME        ACGIH TLV
OSHA PEL
ACGIH
Gold
0.1 mg/m3
0.01mg/m3
NA
Boron Nitride
10 mg/m3
1
0 mg/m3
NA
Zinc Oxide
10 mg/m3
15 mg/m3
10 mg/m3
Aluminum Oxide
10 mg/m3
10 mg/m3
NA
Polyol Ester
NA
NA
NA
The symptoms:
Have you begun experiencing artifacts and other odd anomalies with your video card? There is a very high probability it is related to heat. Over time, the thermal paste and thermal pads used to provide heat conduction properties begin to fail under prolonged, extreme heat conditions. This is especially true of video cards used for Bitcoin/LiteCoin mining or hard core gaming, where a high TDP video card is run under full load for prolonged periods of time.
When you disassemble your video card, you will normally see the thermal paste on the GPU is dried and cracked. Your thermal pads have dissolved or torn apart and are a mess. What do you do to fix it? You have to have the right thickness of thermal pad (too thick will not allow your thermal paste to engage the GPU surface). The right type (tech specs) to do the job and the precise shapes to fit your card (which are probably all looking like wadded up chewing gum about now).
There are many opinions regarding thermal cooling with other than paste. There are pads, pads and more pads. Some like the ones that come stock on video cards, is the cheapest they could get away with. If we all had engineering degrees, we would know that the effectiveness of thermal conductivity is enhanced by how close two things can get together to transfer heat or that distance bridged by an effective conductor. Some people go to great expense to lap CPUs and some enthusiasts delid CPUs to get closer to the die.
In today's video card cooling solutions the heatsink often sits offset by an air gap from the chips it is trying to cool. The first priority in assembling the cooling device is the marriage of heatsink to PCB, are the GPU(s) contact point(s). Today's thermal solutions have a specialized pad with most of times pure copper contacts and a superior TIM does that job well. The rest of the chips and components on the PCB are not so lucky. They are usually divided by a sizable air gap from the heatsink. Filling that void is the magic to good cooling. The best solution does three things. Well four maybe.
The filling for the air gap has to conduct heat at an industry acceptable level (or better), It has to get as close as can be got to the chip surface and it must get as close as can be got to the heatsink.
The fourth is that is can be accomplished in a no-brainer fashion. We got it!
After careful comparison and trying all solutions anyone has offered us we believe gel is the best solution. We deliver a gel thermal pad solution that changes to a viscuous gel when heated and bonds more closely to the surface than any other thermal solution on the market. This closeness is also enjoyed by the heatsink side. The beauty of it is, no matter how rough your surface (no lapping needed) you get a complete and perfect bond. When the card returns to room temperature the gel resolidifies. We're not saying you shouldn't be careful disassembling it after use; but, any damaged pads can easily be replaced, as you are provided enough gel material for about 1 2/3 applications (Two pads is three complete applications).